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Tepla Kirchheim | Plasma SystemsLanguage:EnglishGermanSearch:Skip navigationHome About Us History of PVA TePla Company Profile Core Competencies PVA TePla Offices NewsApplications Photo Resist Processing Photo Resist Removal Sacrificial Layer Removal Descumming after Lithography Polymer Removal after Bosch Process Surface Conditioning Solar Cell Edge IsolationMetrology Shear Stress in Wafers Shear Stress in Devices Implant Process Monitoring Trace Metal Contamination Detection Ultrasonic Inspection3D IC / Thin Wafer Ashing Surface Cleaning Surface Activation Surface Passivation Stress Relief Wafer Thinning Ultrasonic Inspection Semiconductor Packaging Oxide Removal Surface Cleaning Surface Activation Decapsulation / Etching Ultrasonic Inspection Industrial / Life Sciences Activation Cleaning Decontamination Coatings Products Batch Process Systems GIGAbatch 310M GIGAbatch 360/380M GIGAbatch 360/380P GIGA 690 IoN Series R&D Systems Single Wafer Systems GIGAfab M GIGAfab A GIGAfab Modular GIGAfab Gen2 Metrology Systems SIRD and SIRIS Stress Imaging Systems SIREX Stress Imaging System TWIN Implant Monitoring System Munich Metrology VPD Systems Scanning Acoustic Microscopes Strip Type Systems 80 Plus Atmospheric Plasma Plasma Pen Desmearing Systems PS 4031 / 4061 / 4081 Services Application Support Analytical Services JenaWave Metrology Service Used System Offers System Refurbishing Previous Systems Contact us Contact us How to find us TePla Worldwide Shows and Events To our Suppliers Semiconductor Packaging Plasma systems for cleaning of substrates and devices, especially prior to wire bonding, flip chip underfill and device packaging. Plasma systems for 3D integration, stress relief etching and wafer thinning on wafers or dies. Read more ... Shows and Events 2015-07-01 07:27 Come and see us at these Trade Shows and Special Events: Read more … July 2015 Front End Plasma systems with batch and single wafer processing for resist ashing, descum, activation and cleaning. Metrology systems for shear stress, implant monitoring, trace metal contamination detection and scanning acoustic microscopy. Read more ... News 2016-08-17 14:11 We are happy to announce the relocation of the PVA Metrology & Plasma Solutions GmbH from Kirchheim to Wettenberg. The different functional units of the Kirchheim site will be distributed between Jena (Service) and Wettenberg (Engineering, Applications, Order Processing and Spare Parts Supply). In the course of the relocation, we will establish a new a
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